Method of manufacturing semiconductor device, semiconductor device, and printed circuit board

Abstract

According to one embodiment, a method of manufacturing a semiconductor device includes: providing a printed circuit board that has a first surface on which a first solder resist is formed and a second surface opposite to the first surface and on which a second solder resist having a first region and a second region is formed, wherein a thickness of the second solder resist in the first region is greater than a thickness of the second solder resist in the second region in a first direction perpendicular to the second surface; placing a semiconductor chip on the first solder resist of the printed circuit board; sealing the semiconductor chip on the printed circuit board; and removing a part of the second solder resist in the first region.

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