Substrate manufacturing method

Abstract

A method for manufacturing a substrate is provided, which can easily separate a carrier and a device layer. The method includes: preparing a laminate on a carrier having a release layer and a device layer sequentially disposed thereon; fixing the laminate to a release device, wherein the release device includes: a first diaphragm having a mounting surface for holding the laminate; and a first pressurizing means for pressurizing the first diaphragm from a surface opposite to the mounting surface, wherein the laminate is fixed to the release device by contact between the carrier and the mounting surface of the first diaphragm; using the first pressurizing means to press the first diaphragm from a surface opposite to the mounting surface to cause it to expand, thereby changing the shape of the carrier or the laminate; and utilizing the shape change of the carrier to generate shear stress between the carrier and the device layer, thereby peeling the device layer from the laminate at the location of the release layer.

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