Manufacturing method of wiring circuit board, manufacturing system of wiring circuit board, and electroplating apparatus

Abstract

The manufacturing method of the wiring circuit board 1 of the present invention includes a conductor layer forming step. In the conductor layer forming step, a conductor layer 32 is formed in the recess R1 of a substrate S having a recess R1. The conductor layer forming step includes a first plating step, a surface treatment step, and a second plating step. In the first plating step, a portion of the conductor layer 32 (conductor layer 32A) is formed by electrolytic plating. In the surface treatment step, the surface of the conductor layer 32A is treated with a treatment solution. In the second plating step, a portion of the conductor layer 32 is further formed on the surface-treated conductor layer 32A by electrolytic plating. The treatment solution contains plating-promoting components.

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