Circuit board structure and manufacturing method thereof

Abstract

A circuit board structure and a manufacturing method thereof are provided. The circuit board structure includes a substrate, a first circuit pattern, a second circuit pattern, a first cover layer, and a dielectric layer. The first circuit pattern is disposed on the substrate and has a first circuit density. The second circuit pattern is disposed on the substrate and has a second circuit density, wherein the second circuit density is greater than the first circuit density. The first cover layer is disposed on the substrate and covers the first circuit pattern. The dielectric layer includes a first portion and a second portion. The first portion covers and is in contact with an upper surface of the first cover layer, and the second portion is in contact with the second circuit pattern.

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