Circuit board structure and manufacturing method thereof
TW202633044APending Publication Date: 2026-08-01UNIMICRON TECH CORP
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- UNIMICRON TECH CORP
- Filing Date
- 2026-01-08
- Publication Date
- 2026-08-01
Smart Images
Figure TWG2TA001071661_001 
Figure TWG2TA001071661_002 
Figure TWG2TA001071661_003
Abstract
A circuit board structure and a manufacturing method thereof are provided. The circuit board structure includes a substrate, a circuit pattern, a buffer structure, and a dielectric layer. The circuit pattern is disposed on the substrate. The buffer structure is disposed on the substrate and is electrically insulated from the circuit pattern. The dielectric layer includes a first portion and a second portion. The first portion covers and is in contact with an upper surface of the circuit pattern. The second portion covers and is in contact with an upper surface of the buffer structure.
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