Heat dissipation module

Abstract

A heat dissipation module includes a housing, a heat dissipation device, a circuit board and a fan assembly. The heat dissipation device is disposed in the housing. The circuit board is disposed in the heat dissipation device and includes a heat source, wherein the heat dissipation device contacts the heat source. The fan assembly includes a bracket and a fan module, wherein the fan module is fixed on the bracket. The bracket is fixed on the housing, wherein the fan module generates an airflow to dissipate the heat from the heat dissipation device.

Description

[Technical Field]

[0001] This invention relates to a heat dissipation module. [Previous Technology]

[0002] With the advancement of technology and the demands of technology, the functions of chips in electronic devices are becoming increasingly powerful, resulting in a significant increase in the heat generated during chip operation. To prevent short circuits due to overheating, heat dissipation devices are added to the chips. Common heat dissipation devices include fans and heat sinks. The heat sinks are placed above and below the chip, and the fan is positioned above or beside the heat sinks, depending on the fan's design. However, heat sinks require considerable space, which can be too much for small electronic devices. In addition, current heat dissipation devices require screws to secure the fan to the top or side of the heat sinks. When it is necessary to install or remove the fan from the heat sink, the casing of the heat sink must be disassembled first, which is quite inconvenient. [Summary of the Invention]

[0003] The present invention provides a heat dissipation module with a heat sink, which can reduce the size of the heat dissipation module and allow the fan to be quickly installed in the heat dissipation module.

[0004] The heat dissipation module of the present invention includes a housing, a heat sink, a circuit board, and a fan assembly. The heat sink is disposed within the housing. The circuit board is disposed within the heat sink and has a heat source, wherein the heat sink is in contact with the heat source. The fan assembly has a bracket and a fan module, wherein the fan module is fixed to the bracket. The bracket is fixed to the housing, wherein the fan module generates an airflow to dissipate heat from the heat sink.

[0005] In one embodiment of the present invention, the bracket further comprises a body and a base, wherein the fan module is fixed to the body, and when the fan assembly is fixed to the housing, there is an angle between the body and the heat sink.

[0006] In one embodiment of the present invention, the angle is 15 degrees to 45 degrees.

[0007] In one embodiment of the present invention, the fan assembly described above further has a plurality of locking fasteners, wherein the base is fixed to the housing through these locking fasteners.

[0008] In one embodiment of the present invention, the above-mentioned body further has two slide rails and two engaging grooves, wherein the two slide rails are respectively disposed on two opposite sides of the body, and the two engaging grooves are respectively disposed in the two slide rails.

[0009] In one embodiment of the present invention, the heat sink has two engaging structures disposed on a surface of the heat sink. Each of the two engaging structures further includes a main body, a protrusion, and a protrusion. The main body is fixed to the surface and has an elastic arm. The protrusion is disposed on the side of the main body and extends toward the main body. The protrusion is disposed on the elastic arm, wherein when the fan assembly is fixed to the heat sink through the engaging structures, the protrusion abuts against the main body, and the elastic arm slides along the slide rail to engage the protrusion with the engaging groove.

[0010] In one embodiment of the present invention, the above-mentioned housing further has a plurality of air inlets and a plurality of air outlets, and the air inlets and the air outlets are perpendicular to each other.

[0011] In one embodiment of the present invention, when the above-mentioned fan assembly is fixed on the heat sink, the bracket is perpendicular to the heat sink.

[0012] In one embodiment of the present invention, the above-mentioned housing further has a plurality of air inlets and a plurality of air outlets, and the air inlets and the air outlets are parallel to each other.

[0013] In one embodiment of the present invention, the fan assembly described above also has a plurality of fasteners, through which the bracket is fixed to the housing.

[0014] In one embodiment of the present invention, the radiator further has two baffles disposed on opposite sides of the radiator.

[0015] Based on the above, the heat dissipation module of the present invention directly contacts the heat source with the heat sink and allows the fan module to directly pass airflow through the heat sink to reduce the temperature of the heat sink. Furthermore, a baffle concentrates the airflow on the surface of the heat sink, eliminating the need for heat dissipation fins and reducing the size of the heat dissipation module. Additionally, fasteners are used to directly fix the fan module to the housing, allowing for direct installation and removal of the fan module without opening the housing.

[0016] In order to make the above features and advantages of the present invention more apparent and understandable, specific embodiments are described below, and detailed descriptions are given in conjunction with the accompanying drawings.

Implementation Method

[0017] FIG1A is a schematic diagram of a heat dissipation module according to an embodiment of the present invention. FIG1B is an exploded view of FIG1A. FIG1C is a cross-sectional view of FIG1A. Referring simultaneously to FIG1A, FIG1B and FIG1C, the present invention provides a heat dissipation module 100, including a housing 110, a heat sink 120, a circuit board 130 and a fan assembly 140. The heat sink 120 is disposed within the housing 110. The circuit board 130 is disposed within the heat sink 120 and has a heat source, wherein the heat sink 120 is in contact with the heat source. The fan assembly 140 has a bracket 141 and a fan module 142, wherein the fan module 142 is fixed to the bracket 141. The bracket 141 is fixed to the housing 110, wherein the fan module 142 generates an airflow F to dissipate heat from the heat sink 120.

[0018] Figure 1D is a schematic diagram of the heat dissipation module of Figure 1A from another perspective. Figure 1E is a partial enlarged view of Figure 1D. Figure 1F is a schematic diagram of the heat dissipation module of Figure 1A from another perspective. Figure 1G is a partial enlarged view of Figure 1F. Referring simultaneously to Figures 1C, 1D, 1E, 1F, and 1G, in this embodiment, the bracket 141 has a body 141a and a base 141b, wherein the body 141a is connected to the base 141b, and the fan module 142 is fixed on the body 141a. The body 141a has two slide rails 141a1, which are respectively disposed on two opposite sides of the body 141a. The body 141a also has two engaging grooves 141a2, which are respectively disposed on the slide rails 141a1. On the other hand, the heat sink 120 has two engaging structures 121, which are disposed on a surface 120a of the heat sink 120. Each of the two engaging structures 121 further includes a body 121a, a protrusion 121b, and a protrusion 121c. The body 121a is fixed to the surface 120a and has a resilient arm 121a1. The protrusion 121b is disposed on the side of the body 121a and extends toward the body 141a. The protrusion 121c is disposed on the resilient arm 121a1, wherein when the fan assembly 140 is fixed to the heat sink 120 through the two engaging structures 121, the protrusion 121b abuts against the body 141a, and the resilient arm 121a1 slides along the slide rail 141a1, causing the protrusion 121c to engage with the engaging groove 141a2.

[0019] In this embodiment, the bracket 141 is fixed to the outer casing 110 via the base 141b, and the body 141a is fixed to the heat sink 120 using two engaging structures 121. Specifically, when the base 141b is fixed to the outer casing 110, the body 141a passes through the outer casing 110, causing the elastic arm 121a1 to slide along the slide rail 141a1. When the elastic arm 121a1 slides along the slide rail 141a1, causing the protrusion 121c on the elastic arm 121a1 to engage with the engaging groove 141a2, the body 141a is fixed to the heat sink 120. Since the protrusion 121b extends towards the body 141a, when the body 141a engages with the engaging structure 121, the protrusion 121b can clamp the body 141a, allowing the body 141a to be better fixed to the heat sink 120.

[0020] As described above, when the fan assembly 140 is fixed to the heat sink 120, there is an angle A between the body 141a and the heat sink 120, where angle A is between 15 and 45 degrees. Furthermore, the body 141a extends from the base 141b in a direction away from the heat sink 120. That is, the body 141a is not perpendicular to the base 141b. In this embodiment, the fan module 142 is, for example, an axial fan, and because there is an angle A between the body 141a and the heat sink 120, the airflow F generated by the fan module 142 will be redirected. On the other hand, the fan module 142 also has multiple fasteners 143, and the base 141b is fixed to the housing 110 through these fasteners 143. In this embodiment, when it is necessary to install the fan module 142 onto the heat sink module 100, it can be directly installed onto the housing 110 without disassembling the housing 110, which is quite convenient.

[0021] Referring again to Figures 1B and 1C, the heat sink 120 also has two baffles 122 disposed on opposite sides of the heat sink 120, wherein the two baffles 122 extend from the surface 120a of the heat sink 120 in a direction away from the circuit board 130. Specifically, the fan assembly 140 is disposed between the two baffles 122, thus the airflow F generated by the fan assembly 140 can be confined between the two baffles 122, reducing the problem of airflow F overflow. Additionally, the housing 110 has a plurality of air inlets 111 and a plurality of air outlets 112, wherein the air inlets 111 are located above the fan assembly 140, and the air outlets 112 are disposed at the end away from the fan assembly 140. That is, the air outlets 112 and the fan assembly 140 are disposed at opposite ends of the heat sink 120, and the air inlets 111 and the air outlets 112 are perpendicular to each other. When the airflow F enters the heat dissipation module 100 through the air inlet 111, the airflow F moves towards the heat sink 120 through the fan module 142, and finally flows out of the heat dissipation module 100 through the air outlet 112.

[0022] As described above, when the airflow F enters the heat dissipation module 100 through the air inlet 111, due to the angle A between the fan module 142 and the heat sink 120, the direction of the airflow F will change after passing through the fan module 142, and it will move along the surface 120a of the heat sink 120 towards the air outlet 112. In this embodiment, the airflow F enters the heat dissipation module 100 vertically through the air inlet 111, and the airflow F will turn 90 degrees after passing through the fan module 142 so that the airflow F flows along the surface 120a of the heat sink 120 towards the air outlet 112. In other embodiments, influenced by the fan module 142, the airflow F may enter the heat dissipation module 100 in a manner not perpendicular to the air inlet 111, and after passing the fan module 142, rotate more than 90 degrees or less than 90 degrees to flow along the surface 120a of the heat sink 120 towards the air outlet 112. This is not limited to the airflow F flowing along the surface 120a of the heat sink 120 towards the air outlet 112 after passing the fan module 142. Since the surface 120a of the heat sink 120 has two baffles 122, the direction of the airflow F is restricted, allowing it to only move towards the air outlet 112. Furthermore, since the heat sink 120 is in contact with a heat source, the heat generated by the heat source is transferred to the surface 120a through the heat sink 120. When the airflow F passes the surface 120a of the heat sink 120, it carries the heat out of the heat dissipation module 100, thereby cooling the heat source. In this embodiment, the heat source is, for example, a chip disposed on the circuit board 130.

[0023] FIG2A is a schematic diagram of a heat dissipation module according to another embodiment of the present invention. FIG2B is an exploded view of FIG2A. FIG2C is a cross-sectional view of FIG2A. Please refer to FIG2A, FIG2B and FIG2C simultaneously. The other embodiment shown therein is substantially the same as the embodiment of FIG1A. The difference is that in the heat dissipation module 100 of FIG1A, the air inlet 111 is provided on the housing 110, and the air inlet 111 and the air outlet 112 are perpendicular to each other. In addition, in the heat dissipation module 100 of FIG1A, the heat sink 120 has a snap-fit ​​structure 121, the fan module 142 is fixed above the heat sink 120, and the body 141a and the heat sink 120 have an angle A. In this embodiment, the air inlet 241a of the heat dissipation module 200 is provided on the bracket 241 of the fan assembly 240, and the air inlet 241a and the air outlet 212 are parallel to each other. In this embodiment, the fan assembly 240 is fixed to one end of the heat sink 220 via the fastener 243, and the bracket 241 is perpendicular to the heat sink 220. When the airflow F enters the heat dissipation module 200 through the air inlet 241a and the fan assembly 242, the airflow F travels directly along the surface 220a of the heat sink 220 towards the air outlet 212. Specifically, in this embodiment, since the air inlet 241a is parallel to the air outlet 212 and the bracket 241 is perpendicular to the heat sink 220, the airflow F does not change direction after entering the heat dissipation module 100. Instead, it travels along the surface 220a of the heat sink 220, carrying away the heat energy transferred from the heat source on the circuit board 230 to the surface 220a of the heat sink 220, thereby reducing the temperature of the heat source.

[0024] In summary, the heat dissipation module of the present invention directly contacts the heat source with the heat sink and allows the fan module to directly pass airflow through the heat sink to reduce the temperature of the heat sink. Furthermore, a baffle concentrates the airflow on the surface of the heat sink, eliminating the need for heat dissipation fins and reducing the size of the heat dissipation module. Additionally, the fan module is directly fixed to the housing using fasteners, allowing for direct installation and removal of the fan module without opening the housing.

[0025] Although the present invention has been disclosed above by way of embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the art may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims. [Simplified Explanation of the Diagram]

[0026] FIG1A is a schematic diagram of a heat dissipation module according to an embodiment of the present invention. FIG1B is an exploded view of FIG1A. FIG1C is a cross-sectional view of FIG1A. FIG1D is a schematic diagram of the heat dissipation module of FIG1A from another perspective. FIG1E is a partially enlarged view of FIG1D. FIG1F is a schematic diagram of the heat dissipation module of FIG1A from another perspective. FIG1G is a partially enlarged view of FIG1F. FIG2A is a schematic diagram of a heat dissipation module according to another embodiment of the present invention. FIG2B is an exploded view of FIG2A. FIG2C is a cross-sectional view of FIG2A.

Claims

1. A heat dissipation module, comprising: A shell; A radiator is installed inside the casing; A circuit board disposed within the heat sink and having a heat source, wherein the heat sink is in contact with the heat source; and a fan assembly having a bracket and a fan module, wherein the fan module is fixed to the bracket and the bracket is fixed to the housing, wherein the fan module generates an airflow to dissipate heat from the heat sink.

2. The heat dissipation module as claimed in claim 1, wherein the bracket further comprises a body and a base, the fan module is fixed to the body, and when the fan assembly is fixed to the housing, there is an angle between the body and the heat sink.

3. The heat dissipation module as described in claim 2, wherein the angle is 15 to 45 degrees.

4. The heat dissipation module as claimed in claim 2, wherein the fan assembly further comprises a plurality of fasteners through which the base is secured to the housing.

5. The heat dissipation module as claimed in claim 2, wherein the body further comprises two slide rails and two engaging slots, wherein the two slide rails are respectively disposed on two opposite sides of the body, and the two engaging slots are respectively disposed in the two slide rails.

6. The heat dissipation module as claimed in claim 5, wherein the heat sink has two engaging structures disposed on one surface of the heat sink, each of the two engaging structures further comprising: A main body, fixed to the surface, and having a flexible arm; A protrusion is provided on the side of the main body and extends in the direction of the main body; And a protrusion is provided on the elastic arm, wherein when the fan assembly is fixed to the heat sink through the locking structure, the protrusion abuts against the body, and the elastic arm slides along the slide rail to make the protrusion engage with the locking groove.

7. The heat dissipation module as claimed in claim 2, wherein the housing further has a plurality of air inlets and a plurality of air outlets, and the air inlets and the air outlets are perpendicular to each other.

8. The heat dissipation module as claimed in claim 1, wherein when the fan assembly is fixed to the heat sink, the bracket is perpendicular to the heat sink.

9. The heat dissipation module as claimed in claim 8, wherein the housing further has a plurality of air inlets and a plurality of air outlets, and the air inlets and the air outlets are parallel to each other.

10. The heat dissipation module as claimed in claim 8, wherein the fan assembly further comprises a plurality of fasteners through which the bracket is secured to the housing.

11. The heat dissipation module as claimed in claim 1, wherein the heat sink further comprises two baffles disposed on opposite sides of the heat sink.

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