Semiconductor device with a partial shielding layer and a method for making the same

Abstract

This application provides a method for fabricating a semiconductor device. The method includes: providing a packaging substrate strip on which a plurality of first electronic components and a plurality of second electronic components are mounted; forming a sealant layer on the packaging substrate strip covering the plurality of first electronic components; forming a first shielding material by spraying such that the first shielding material extends continuously from a top surface of the sealant layer to a top surface of the packaging substrate strip, at least covering the side surface of the sealant layer facing the plurality of second electronic components; dividing the packaging substrate strip into individual semiconductor packages having corresponding packaging substrates; and forming a second shielding material on the sealant layer by sputtering, wherein the second shielding material at least partially overlaps the first shielding material.

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