Semiconductor device comprising back pattern
TW202633066APending Publication Date: 2026-08-01SAMSUNG ELECTRONICS CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-10-17
- Publication Date
- 2026-08-01
Smart Images

Figure TWG2TA001070914_001 
Figure TWG2TA001070914_002 
Figure TWG2TA001070914_003
Abstract
A semiconductor device includes memory cells on a front surface of a substrate, a first back pattern on a back surface of the substrate, and a second back pattern on the back surface of the substrate. The first back pattern includes first ground lines arranged in a first direction and extending in a second direction intersecting the first direction, and power lines extending in the second direction, where the first ground lines and the power lines are arranged alternately in the first direction, and the second back pattern includes back word lines arranged in the second direction and extending in the first direction.
Need to check novelty before this filing date? Find Prior Art