Doped multi-layer structures for stack uniformity in devices, and related methods and apparatus

TW202633077APending Publication Date: 2026-08-01APPLIED MATERIALS INC
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
APPLIED MATERIALS INC
Filing Date
2025-09-09
Publication Date
2026-08-01

Smart Images

  • Figure TWG2TA001070372_001
    Figure TWG2TA001070372_001
  • Figure TWG2TA001070372_002
    Figure TWG2TA001070372_002
  • Figure TWG2TA001070372_003
    Figure TWG2TA001070372_003
Patent Text Reader

Abstract

Embodiments of the present disclosure generally relate to epitaxial processes and materials, and more specifically, epitaxial processes for preparing materials, layers, stacks, and devices. In one or more embodiments, a device includes a multi-layer structure disposed on a substrate. The multi-layer structure includes a plurality of doped silicon-germanium (SiGe) layers. The doped SiGe layers respectively include a dopant having a concentration in a range from about
Need to check novelty before this filing date? Find Prior Art