Doped multi-layer structures for stack uniformity in devices, and related methods and apparatus
TW202633077APending Publication Date: 2026-08-01APPLIED MATERIALS INC
View PDF 0 Cites 0 Cited by
Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- APPLIED MATERIALS INC
- Filing Date
- 2025-09-09
- Publication Date
- 2026-08-01
Smart Images

Figure TWG2TA001070372_001 
Figure TWG2TA001070372_002 
Figure TWG2TA001070372_003
Abstract
Embodiments of the present disclosure generally relate to epitaxial processes and materials, and more specifically, epitaxial processes for preparing materials, layers, stacks, and devices. In one or more embodiments, a device includes a multi-layer structure disposed on a substrate. The multi-layer structure includes a plurality of doped silicon-germanium (SiGe) layers. The doped SiGe layers respectively include a dopant having a concentration in a range from about
Need to check novelty before this filing date? Find Prior Art