Memory device, memory system and method for forming memory device

TW202633082APending Publication Date: 2026-08-01YANGTZE MEMORY TECH CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
YANGTZE MEMORY TECH CO LTD
Filing Date
2022-12-13
Publication Date
2026-08-01

Smart Images

  • Figure TWG2TA001071938_001
    Figure TWG2TA001071938_001
  • Figure TWG2TA001071938_002
    Figure TWG2TA001071938_002
  • Figure TWG2TA001071938_003
    Figure TWG2TA001071938_003
Patent Text Reader

Abstract

A memory device includes a stack structure over a substrate, a channel structure extending in the stack structure, and a dielectric layer over the channel structure. The dielectric layer includes a first material. The memory device may also include a drain selection gate (DSG) cut structure extending through the dielectric layer. A material of the DSG cut structure includes a second material different from the first material.
Need to check novelty before this filing date? Find Prior Art