Memory device, memory system and method for forming memory device
TW202633082APending Publication Date: 2026-08-01YANGTZE MEMORY TECH CO LTD
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- YANGTZE MEMORY TECH CO LTD
- Filing Date
- 2022-12-13
- Publication Date
- 2026-08-01
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Figure TWG2TA001071938_001 
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Figure TWG2TA001071938_003
Abstract
A memory device includes a stack structure over a substrate, a channel structure extending in the stack structure, and a dielectric layer over the channel structure. The dielectric layer includes a first material. The memory device may also include a drain selection gate (DSG) cut structure extending through the dielectric layer. A material of the DSG cut structure includes a second material different from the first material.
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