Semiconductor devices

TW202633085APending Publication Date: 2026-08-01KIOXIA CORP
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
KIOXIA CORP
Filing Date
2021-02-01
Publication Date
2026-08-01

Smart Images

  • Figure TWG2TA001071873_001
    Figure TWG2TA001071873_001
Patent Text Reader

Abstract

According to one embodiment, a semiconductor device includes: a substrate; and a multilayer film comprising a plurality of electrode layers and a plurality of insulating layers alternately disposed above the substrate. The device further includes: a first semiconductor layer disposed within the multilayer film; and a second semiconductor layer disposed within the multilayer film on the first semiconductor layer, and comprising a single-crystal semiconductor layer. The device further includes a wiring layer disposed on the multilayer film and the second semiconductor layer, and electrically connected to the second semiconductor layer.
Need to check novelty before this filing date? Find Prior Art