Semiconductor memory devices, methods for manufacturing semiconductor memory devices

Abstract

One embodiment provides a semiconductor memory device and a method for manufacturing the semiconductor memory device that reduces the requirements for processing technology or processing accuracy. The semiconductor memory device of one embodiment includes: a substrate; a semiconductor memory disposed on the substrate; and an electronic component comprising a body having a central axis and leads extending from the body, the leads being connected to a connection portion of the substrate. The electronic component is configured such that the central axis of the body is within the thickness of the substrate in the thickness direction. The leads are fixed to the connection portion with their extended tips facing the connection portion in the extension direction of the leads extending from the body.

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