Stacked capacitor device and manufacturing method thereof

Abstract

A stacked capacitor device of this invention is provided, the stacked capacitor includes at least one first die, at least one second die, and a plurality of through via structures. A first capacitor element is disposed on a first surface of the first die, a second capacitor element is disposed on a first surface of the second die, and the first surface of the second die faces towards the first surface of the first die. The through via structures extend from a second surface of the second die through the second die and are respectively coupled to the first capacitor element and the second capacitor element. The number of the first dies is one or more. The number of the second dies is one or more.

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