Semiconductor device and method for fabricating the same
TW202633119APending Publication Date: 2026-08-01SAMSUNG ELECTRONICS CO LTD
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- SAMSUNG ELECTRONICS CO LTD
- Filing Date
- 2025-09-17
- Publication Date
- 2026-08-01
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Figure TWG2TA001070447_001 
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Abstract
A semiconductor device and processes for fabricating the same are provided. A semiconductor device includes a dielectric wall; a first semiconductor layer extending in a first direction perpendicular from a first side of the dielectric wall, the first semiconductor layer having a first end that is nearest to the dielectric wall; and a first gate electrode layer including a first gate extension that extends beyond the first end of the first semiconductor layer and is nearer to the first side of the dielectric wall than the first end of the first semiconductor layer.
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