Semiconductor device and method of forming the same
TW202633124APending Publication Date: 2026-08-01TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
- Filing Date
- 2025-04-29
- Publication Date
- 2026-08-01
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Abstract
A semiconductor structure is disclosed that includes: a source region and a drain region in a substrate; a first gate structure disposed above a first channel region in the substrate and between the source region and the drain region wherein the first gate structure includes a first gate dielectric disposed above the first channel region and a first gate electrode disposed above the first gate dielectric; and a second gate structure disposed above a second channel region in the substrate and between the first gate structure and the drain region, wherein the first gate structure is disposed closer to the source region and the second gate structure is disposed closer to the drain region.
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