Semiconductor device and methods of forming the same

TW202633151APending Publication Date: 2026-08-01TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-05-01
Publication Date
2026-08-01

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Abstract

Embodiments of the present disclosure provide semiconductor devices and methods of forming the same. An exemplary semiconductor device of the present disclosure includes a first channel region disposed over a semiconductor substrate; a gate structure disposed over the first channel region; a first source / drain region disposed at a first side of the first channel region; a second source / drain region disposed at a second side of the first channel region; an interlayer dielectric layer disposed over the first channel region, the first source / drain region, and the second source / drain region; a first contact disposed in the interlayer dielectric layer and electrically coupled to the first source / drain region; and a second contact disposed in the semiconductor substrate and electrically coupled to the second source / drain region.
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