Integrated circuit device
TW202633154APending Publication Date: 2026-08-01SAMSUNG ELECTRONICS CO LTD
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-06-05
- Publication Date
- 2026-08-01
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Abstract
Provided is an integrated circuit device including a substrate, a first insulating pillar extending in a first direction intersecting a surface of the substrate, a first channel structure including a first sheet and a second sheet, the first sheet and the second sheet spaced apart in a second direction intersecting the first direction with the first insulating pillar interposed between the first sheet and the second sheet in the second direction, a second insulating pillar spaced apart from the first insulating pillar in the second direction on the substrate, and a second channel structure including a third sheet and a fourth sheet, the third sheet and the fourth sheet spaced apart in the second direction with the second insulating pillar interposed between the third sheet and the fourth sheet in the second direction.
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