Integrated circuit device

TW202633154APending Publication Date: 2026-08-01SAMSUNG ELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-06-05
Publication Date
2026-08-01

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Abstract

Provided is an integrated circuit device including a substrate, a first insulating pillar extending in a first direction intersecting a surface of the substrate, a first channel structure including a first sheet and a second sheet, the first sheet and the second sheet spaced apart in a second direction intersecting the first direction with the first insulating pillar interposed between the first sheet and the second sheet in the second direction, a second insulating pillar spaced apart from the first insulating pillar in the second direction on the substrate, and a second channel structure including a third sheet and a fourth sheet, the third sheet and the fourth sheet spaced apart in the second direction with the second insulating pillar interposed between the third sheet and the fourth sheet in the second direction.
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