Semiconductor devices including stressor layers and methods of forming the same
TW202633162APending Publication Date: 2026-08-01SAMSUNG ELECTRONICS CO LTD
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-07-23
- Publication Date
- 2026-08-01
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Abstract
A semiconductor device includes a substrate, a source / drain region on the substrate, a channel structure on the substrate and electrically connected to the source / drain region, a gate structure on the substrate and at least partially surrounding the channel structure, and a stressor layer in contact with an upper surface of the source / drain region and configured to apply compressive stress or tensile stress to the source / drain region.
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