Electronic stacked structure and manufacturing method thereof

TW202633182AInactive Publication Date: 2026-08-01NAN YA TECH
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
NAN YA TECH
Filing Date
2025-02-17
Publication Date
2026-08-01
Estimated Expiration
Not applicable · inactive patent

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Abstract

The disclosure provides an electronic stacked structure including a first device, an insulating block, and a second device. The first device includes a first circuit layer and through vias disposed on the first circuit layer. The through vias comprise a functional through via and a dummy through via. The insulating block is directly covering and contacting the dummy through via. The second device includes a second circuit layer. The first circuit layer is electrically connected to the second circuit layer through the functional through via. A manufacturing method of an electronic stacked structure is also provided.
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