Semiconductor device and methods of formation

TW202633188APending Publication Date: 2026-08-01TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-03-12
Publication Date
2026-08-01

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Abstract

A semiconductor device includes an electrostatic discharge (ESD) protection device that includes a plurality of non-contiguous implant portions that are spaced apart with respective well regions between the non-contiguous implant portions in a substrate of the semiconductor device. The space between the non-contiguous implant portions provides areas in the substrate in which dopants from the non-contiguous implant portions may diffuse. Thus, the dopants can diffuse into the substrate across a greater area of the substrate than in a source / drain region including continuous implant portions. As a result, the dopant concentration from the implant portions may be reduced in the substrate. This reduces the build-up and concentration of dopants near a gate structure, which reduces the strength of the electric field near the gate structure. The reduced strength of the electric field near the gate structure lessens the damage caused to the ESD protection device across multiple ESD events.
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