Semiconductor device and method of manufacturing the same
TW202633194APending Publication Date: 2026-08-01TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-08-14
- Publication Date
- 2026-08-01
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Figure TWG2TA001070270_001 
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Figure TWG2TA001070270_003
Abstract
Various embodiments of the present disclosure are directed towards a device. The device includes a substrate comprising a first material. An absorption structure is on a surface of the substrate and comprises a second material having a smaller bandgap than the first material. The absorption structure has a first doping concentration of a first doping type. The first doping concentration of the absorption structure is greater than a doping concentration of a region of the substrate abutting the absorption structure. A first well region is in the substrate and offset from the absorption structure. The first well region has a second doping type different from the first doping type. A second well region is in the substrate and arranged between the first well region and the absorption structure. The second well region has the first doping type.
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