Sensor package and manufacturing method thereof

Abstract

A sensor package includes a sensor die, an insulating layer covering the second side of the sensor die, a cover layer, a dielectric dam between the cover layer and the sensor die, a circuit substrate coupled to the sensor die, and an encapsulant laterally covering the cover layer, the dielectric dam, and the insulating layer. The sensor die includes opposing first and second sides, a sensing area at the first side, conductive terminals at the second side and coupling the sensor die to the circuit substrate. The insulating layer exposes the first side of the sensor die. The cover layer is disposed above the first side of the sensor die and covers the sensing area, the dielectric dam is disposed outside the sensing area, and the encapsulant extends into a gap between the circuit substrate and the insulating layer to surround the conductive terminals.

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