Optical semiconductor devices

Abstract

The disclosed opto-semiconductor device includes a lead, an opto-semiconductor element, and a sealing member. The sealing member includes: a thick-walled portion; a first thin-walled portion disposed on one side in a second direction relative to the thick-walled portion; and a second thin-walled portion disposed on the other side in the second direction relative to the thick-walled portion. The lead includes a first portion protruding from the thick-walled portion when viewed from one side in the first direction. The first portion contacts the first thin-walled portion and extends along the first thin-walled portion towards one side in the second direction. The first portion has a front surface exposed on one side in the first direction and a back surface exposed on the other side in the first direction. The width of the first thin-walled portion in the second direction is greater than the width of the first portion in the third direction.

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