Through-hole contact for micro light-emitting diode and method for forming the same

Abstract

A through-hole contact for a micro light-emitting diode is provided. The through-hole contact is configured to electrically connect a first conductive structure and a second conductive structure. The first conductive structure is located below the through-hole contact, and the second conductive structure is located above the through-hole contact. The through-hole contact includes a through-hole formed in an insulating layer and having a cavity, a filler metal disposed in the cavity of the through-hole for conducting electricity and a first metal barrier layer disposed between a bottom of the through-hole and the first conductive structure and / or a top of the through-hole and the second conductive structure to block diffusion of the filler metal. Furthermore, the present invention also provides a method for forming the through-hole contact. Through the present invention, metal diffusion in the through-hole contact can be effectively suppressed.

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