First circuit device, second circuit device and apparatus

Abstract

A first circuit device, a second circuit device, and an apparatus are provided. The first circuit device (31) is used to provide drive signals to N components. The first circuit device (31) includes: a first insulating substrate, a first circuit layer disposed on the first insulating substrate, and a first connection pad layer. The first circuit layer includes: N drive sub-circuits (11) arranged in a B×A array, where N=A×B, and A and B are both positive integers greater than 0. The first connection pad layer is located on the side of the first circuit layer away from the first insulating substrate, and the surface of the first connection pad layer away from the first insulating substrate is at least partially exposed. The first connection pad layer includes: P connection pads, which are connected to the N drive sub-circuits (11), where N and P are both positive integers greater than 0.

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