Semiconductor testing structure

Abstract

A semiconductor testing structure includes a carrier, a conductive layer, adhesive portions and semiconductor devices. The conductive layer is located on the carrier and includes a continuous surface. The continuous surface includes a first area and a second area. A first adhesive portion and a second adhesive portion are located on the conductive layer, cover the first area and expose the second area. A first semiconductor device and a second semiconductor device are respectively located on the first adhesive portion and the second adhesive portion. The first semiconductor device includes a first lower electrode, a first semiconductor stack and a first upper electrode. In a cross-sectional view, the first lower electrode faces the first adhesive portion, and the first upper electrode faces away from the first adhesive portion.

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