Substrate processing system and substrate processing method

Abstract

[Problem] In an overlapping substrate formed by bonding a first substrate and a second substrate, the peripheral portion of the first substrate, which is the target of removal, is appropriately removed. [Solution] The control unit performs the following control: irradiating a plurality of points arranged in the thickness direction of the first substrate with laser light on the radially outer side of the inner periphery of the peripheral portion of the first substrate, or along the peripheral portion, to form a first modified region including a modified first modified portion and a first crack extending from the first modified portion; preventing the first crack from reaching the back side of the first substrate opposite to the second substrate; irradiating a plurality of points arranged in the thickness direction of the first substrate with laser light on the radially inner side of the first modified region to form a second modified region including a modified second modified portion and a second crack extending from the second modified portion; and ensuring that the second crack reaches the back side of the first substrate and connects with the first modified region.

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