Protective film forming agent for silicon-based substrate, method for processing silicon-based substrate, and method for manufacturing semiconductor device
TW202633256APending Publication Date: 2026-08-01TOKYO OHKA KOGYO CO LTD
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- TOKYO OHKA KOGYO CO LTD
- Filing Date
- 2025-10-17
- Publication Date
- 2026-08-01
Abstract
A protective film forming agent for silicon substrates is provided, as well as a method for processing silicon substrates using the same and a method for manufacturing semiconductor devices using the same. The protective film forming agent for silicon substrates contains a silicon alkylating agent and a solvent with an SP value of 17.5 or less with Hildebrand.
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