Plate and absorptive mass arrangements for localized thermal adjustability, and related methods and processing chambers
TW202633258APending Publication Date: 2026-08-01APPLIED MATERIALS INC
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- APPLIED MATERIALS INC
- Filing Date
- 2025-09-30
- Publication Date
- 2026-08-01
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Figure TWG2TA001070603_001 
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Abstract
The present disclosure relates to plate and absorptive mass arrangements for localized thermal adjustability, and related methods and processing chambers. In one or more embodiments, a processing chamber includes a chamber body at least partially defining an internal volume, a substrate support disposed in the internal volume, a plate apparatus disposed in the internal volume and at least partially defining a processing volume between the plate apparatus and the substrate support. The plate apparatus includes one or more flow openings formed in one or more plate walls. The processing chamber includes one or more absorptive masses disposed in the one or more flow openings.
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