Plate and absorptive mass arrangements for localized thermal adjustability, and related methods and processing chambers

TW202633258APending Publication Date: 2026-08-01APPLIED MATERIALS INC
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
APPLIED MATERIALS INC
Filing Date
2025-09-30
Publication Date
2026-08-01

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Abstract

The present disclosure relates to plate and absorptive mass arrangements for localized thermal adjustability, and related methods and processing chambers. In one or more embodiments, a processing chamber includes a chamber body at least partially defining an internal volume, a substrate support disposed in the internal volume, a plate apparatus disposed in the internal volume and at least partially defining a processing volume between the plate apparatus and the substrate support. The plate apparatus includes one or more flow openings formed in one or more plate walls. The processing chamber includes one or more absorptive masses disposed in the one or more flow openings.
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