Substrate electroplating apparatus, electroplating equipment and substrate electroplating method

Abstract

A substrate electroplating apparatus, electroplating equipment, and substrate electroplating method are disclosed. The substrate electroplating apparatus includes: a tank having an inlet, an outlet, and a plating chamber, the plating chamber being used to contain electroplating solution and configured as a closed chamber during electroplating; a substrate holding element for holding the substrate and holding the substrate in a vertical position inside the plating chamber during electroplating, wherein the substrate has a plating surface; an anode located inside the plating chamber and facing the plating surface; the electroplating solution is configured to flow from one side of the plating chamber through the inlet along a first direction to the other side of the plating chamber and then be discharged from the outlet to the plating chamber, thereby forming a flow field parallel to the plating surface on the plating surface, wherein the first direction is a direction parallel to the plating surface.

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