Manufacture method for manufacturing a wafer structure

Abstract

to produce the wafer structure. The wafer structure comprises the trap-rich layer bonded against the handle wafer so that a grain structure in the trap-rich layer is coarser adjacent to the handle wafer and a grain size in the grain structure decreases away from the handle wafer to improve a trap-ping efficiency of the wafer structure in the trap-rich layer in an interface (IF) towards the top wafer.

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