Methods for stress management in a substrate

TW202633278APending Publication Date: 2026-08-01APPLIED MATERIALS INC
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
APPLIED MATERIALS INC
Filing Date
2025-10-03
Publication Date
2026-08-01

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Abstract

A method for stress management in a substrate. The method may include providing a stress compensation layer on a main surface of the substrate, and performing a high-temperature implant procedure in an ion implanter to implant a dose of ions into the stress compensation layer. The high temperature implant procedure may include heating the substrate to an implant temperature, the implant temperature being between
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