Substrate processing method and substrate processing system
TW202633280APending Publication Date: 2026-08-01TOKYO ELECTRON LTD
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- TOKYO ELECTRON LTD
- Filing Date
- 2025-11-10
- Publication Date
- 2026-08-01
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Abstract
A substrate processing method for processing an overlapping substrate, wherein the overlapping substrate is formed by bonding a first substrate with a multilayer film formed on its surface and a second substrate, the method comprising: filling the gap between the outer periphery of the first substrate and the outer periphery of the second substrate with a filler material; and irradiating the outer periphery of the first substrate with a laser to form a modified region.
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