Substrate processing apparatus, its operation method and substrate processing system

Abstract

This invention relates to a substrate processing apparatus and its operating method. According to an embodiment of the invention, the substrate processing apparatus performs a heating process on a semiconductor substrate. The substrate processing apparatus may include: a support chuck for supporting the semiconductor substrate; a plurality of light-absorbing portions disposed on one side of the support chuck; and a plurality of lasers for irradiating the plurality of light-absorbing portions. The arrangement and number of the plurality of light-absorbing portions can be determined to maintain a uniform temperature distribution in each region of the support chuck.

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