Substrate processing system, substrate processing method and computer recording medium

TW202633284APending Publication Date: 2026-08-01TOKYO ELECTRON LTD
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
TOKYO ELECTRON LTD
Filing Date
2025-03-28
Publication Date
2026-08-01

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Abstract

This invention relates to a substrate processing system, a substrate processing method, and a computer recording medium, which appropriately performs laser processing on a substrate. The substrate processing system of this invention includes: a laser irradiation unit that irradiates the substrate with laser light from above; an image acquisition unit that acquires a projected image of the substrate from the side of the substrate; and a control unit. The control unit performs the following control: acquiring the projected image by the image acquisition unit before the laser light is irradiated onto the substrate by the laser irradiation unit; and determining, based on the projected image before irradiation, at least one of the irradiation position of the laser light in the substrate or the output of the laser light.
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