Substrate processing device

TW202633288APending Publication Date: 2026-08-01TOKYO ELECTRON LTD
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
TOKYO ELECTRON LTD
Filing Date
2025-09-17
Publication Date
2026-08-01

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    Figure TWG2TA001070446_003
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Abstract

The substrate processing apparatus of the present invention includes a chamber, a shield, and a drive unit. The chamber is configured such that an opening of a size through which a substrate can pass is formed in the side wall, and substrate processing can be performed inside. The shield is disposed along the side wall in which the opening of the chamber is formed, and the opening is opened and closed by lifting and lowering it above the opening. The drive unit drives the shield to lift and lower.
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