Semiconductor processing equipment and methods

TW202633294APending Publication Date: 2026-08-01ADVANCED MICRO FAB EQUIP INC CHINA
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
ADVANCED MICRO FAB EQUIP INC CHINA
Filing Date
2025-12-29
Publication Date
2026-08-01

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    Figure TWG2TA001071598_003
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Abstract

This invention provides a semiconductor processing apparatus, comprising: a cavity, the cavity being divided into two reaction chambers by a partition wall, a base for supporting a substrate being provided within the reaction chamber, and a common evacuation channel being provided at the center of the bottom of the cavity; a pendulum valve connected to a vacuum pumping device, including a valve port and a pendulum valve plate, the valve port being located directly below the evacuation channel, and the pendulum valve plate being able to rotate horizontally around a rotation axis on one side to adjust the valve port opening; a transition flange having a cylindrical structure, the evacuation channel being connected to the valve port via the transition flange; and a flow divider plate, at least partially disposed inside the transition flange and perpendicular to the pendulum valve plate, the flow divider plate being configured to adapt to the movement path of the pendulum valve plate, so that the gas flow rate into the valve port of each reaction chamber is the same under different valve port openings.
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