Chemical mechanical polishing apparatus and method of chemical mechanical polishing
TW202633301APending Publication Date: 2026-08-01APPLIED MATERIALS INC
View PDF 0 Cites 0 Cited by
Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- APPLIED MATERIALS INC
- Filing Date
- 2020-02-13
- Publication Date
- 2026-08-01
Smart Images
Figure TWG2TA001071822_001 
Figure TWG2TA001071822_002 
Figure TWG2TA001071822_003
Abstract
A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature control system including a source of a fluid medium and one or more openings positioned over the platen and separated from the polishing pad and configured for the fluid medium to flow onto the polishing pad to heat or cool the polishing pad.
Need to check novelty before this filing date? Find Prior Art