Laser processing methods, semiconductor device manufacturing methods, and laser processing equipment

Abstract

A laser processing method includes: a first processing step involving laser processing along a first predetermined forming surface, and a second processing step involving laser processing along a second predetermined forming surface. In both the first and second processing steps, the laser light is formed such that, viewed from the Z-direction, the focusing region of the laser light has a length direction, and this length direction intersects with the processing travel direction. In the first processing step, laser processing is performed under first processing conditions for causing cracks to extend from the modified region along the first predetermined forming surface; in the second processing step, laser processing is performed under second processing conditions for causing cracks to extend from the modified region along the second predetermined forming surface. The tilt angle of the second predetermined forming surface is larger than the tilt angle of the first predetermined forming surface.

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