Peeling method, peeling apparatus, processing equipment and storage medium

TW202633304APending Publication Date: 2026-08-01SHENZHEN HANS SEMICONDUCTOR EQUIPMENT TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
SHENZHEN HANS SEMICONDUCTOR EQUIPMENT TECHNOLOGY CO LTD
Filing Date
2026-01-26
Publication Date
2026-08-01

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Abstract

The application is applicable to the technical field of material processing and provides a peeling method, a peeling apparatus, processing equipment, and a storage medium. The peeling method includes: securing a workpiece that has processing marks; and tearing the workpiece along the processing marks from the edge of the workpiece, such that a portion of the workpiece from the surface to the processing marks undergoes elastic deformation, thereby peeling a flake-shaped sub-component from the workpiece along the processing marks. The peeling method provided by embodiments of the application can reduce implementation difficulty.
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