Substrate processing apparatus and substrate processing method

Abstract

[Objective] To provide a technique that can improve the uniformity of airflow within a processing container. A substrate processing apparatus according to one aspect of this disclosure includes a processing container, a holding portion that holds a substrate horizontally in a holding position within the processing container, and a fluid supply portion that supplies processing fluid to the interior of the processing container from the side. When the substrate is held in the holding portion, a first distance between a first virtual surface (including the upper surface of the substrate) and the top surface of the processing container is different from a second distance between a second virtual surface (including the lower surface of the substrate) and the bottom surface of the processing container. The fluid supply portion has a nozzle that modulates the flow of the processing fluid. The nozzle has a first discharge portion that discharges the processing fluid at a first discharge amount from a position above the first virtual surface, and a second discharge portion that discharges the processing fluid at a second discharge amount from a position below the second virtual surface. The relationship between the first discharge amount and the second discharge amount is consistent with the relationship between the first distance and the second distance.

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