Method for processing substrate

TW202633307APending Publication Date: 2026-08-01TOKYO ELECTRON LTD
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
TOKYO ELECTRON LTD
Filing Date
2025-09-22
Publication Date
2026-08-01

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Abstract

A method for processing a substrate includes providing the substrate into a processing chamber, adding a processing fluid into the processing chamber, adding a dry fluid to the processing chamber while draining the processing fluid from the processing chamber, and releasing the dry fluid from the processing chamber in a gaseous phase.
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