Substrate processing method, substrate processing apparatus and substrate processing solution

Abstract

This invention provides a substrate processing method, a substrate processing apparatus, and a substrate processing liquid that can further prevent the collapse of patterns formed on the surface of a substrate during sublimation drying. The substrate processing method of this invention processes the pattern-forming surface of a substrate W and includes: a supply step, which supplies a substrate processing liquid containing a sublimable substance and a solvent to the pattern-forming surface; a curing step, which evaporates the solvent in the liquid film of the substrate processing liquid supplied to the pattern-forming surface in the supply step, causing the sublimable substance to precipitate, thereby forming a cured film containing the sublimable substance; and a sublimation step, which sublimates the cured film to remove the cured film; the sublimable substance includes at least one of 2-(1-adamantyl)-4-methylphenol, 3,5-dimethyl-1-adamantanol, and hexahydrophthalimide.

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