Substrate processing method and substrate processing apparatus

Abstract

In one exemplary embodiment, the substrate processing method includes the following steps: (a) providing a substrate to a substrate support in a cavity, the substrate having a film and a metal-containing mask on the film, the metal-containing mask having at least one opening, and the substrate containing halogen; and (b) exposing the substrate to a purge gas or plasma generated by the purge gas to remove the halogen; and in (b), the temperature of the substrate support does not reach 160°C.

Images