Wafer cleaning method

TW202633315APending Publication Date: 2026-08-01MERCK PATENT GMBH
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
MERCK PATENT GMBH
Filing Date
2025-12-04
Publication Date
2026-08-01
Patent Text Reader

Abstract

The disclosed and claimed subject matter relates to a wafer cleaning method for reducing metal contamination during metal-based material processing.
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