Wafer cleaning method
TW202633315APending Publication Date: 2026-08-01MERCK PATENT GMBH
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- MERCK PATENT GMBH
- Filing Date
- 2025-12-04
- Publication Date
- 2026-08-01
Abstract
The disclosed and claimed subject matter relates to a wafer cleaning method for reducing metal contamination during metal-based material processing.
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