Cleaning methods and equipment for wafer buffer layer edges

Abstract

This application provides a method and apparatus for cleaning the edge of a wafer buffer layer. The cleaning method includes: rotating the wafer and spraying a first cleaning solution onto the wafer surface to remove the buffer layer at the wafer edge, thereby forming by-product imprints on the wafer surface; obtaining the position of the by-product imprints and marking it as a mark position; keeping the wafer rotating and spraying a second cleaning solution onto the mark position to remove the by-product imprints on the wafer surface; and spraying a rinsing solution onto the wafer surface to rinse the wafer. The wafer buffer layer edge cleaning method of this application specifically cleans the by-product imprints on the wafer surface, improving wafer yield.

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