Semiconductor substrate processing apparatus and processing method

Abstract

This application discloses a semiconductor substrate processing apparatus and method, relating to the field of semiconductor manufacturing equipment. The semiconductor substrate processing apparatus includes: a processing tank for containing an etching solution; a holding mechanism for holding the semiconductor substrate and immersing it in the etching solution; a bubbling device for supplying gas to the processing tank; and a controller configured to control the bubbling device to supply gas to the processing tank to intermittently generate multiple sets of bubbles in the etching solution, wherein there is an interval between adjacent sets of bubbles, and the bubbling device does not generate bubbles during the interval, wherein the length of the interval is set such that the etching solution does not flow back into the bubbling device. By intermittently generating multiple sets of bubbles, not only can the etching efficiency be improved, but the concentration of byproducts within the patterned structure of the semiconductor substrate can also be reduced, avoiding back-adhesion or redeposition phenomena, which is beneficial to improving the uniformity of etching.

Images