Devices and methods for finding wafer center in semiconductor processing system and method for accurately positioning wafer in semiconductor processing system

TW202633324APending Publication Date: 2026-08-01ASM IP HLDG BV
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
ASM IP HLDG BV
Filing Date
2025-09-11
Publication Date
2026-08-01

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Abstract

The present disclosure generally relates to the field of semiconductor processing, and in particular devices and methods for handling and accurately positioning wafers during various stages of semiconductor manufacturing. The present disclosure further relates to semiconductor processing systems comprising said specifically designed devices.
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