Processing device and correction method
TW202633329APending Publication Date: 2026-08-01TOKYO ELECTRON LTD
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- TOKYO ELECTRON LTD
- Filing Date
- 2025-11-18
- Publication Date
- 2026-08-01
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Abstract
This invention relates to a processing apparatus having a processing chamber for processing a substrate and a stage including a circular mounting portion for placing the substrate. The substrate placed on the mounting portion is processed. The stage supports an annular member formed to surround the substrate placed on the mounting portion. A transport robot that transports the substrate to the mounting portion has an end effector to hold and transport the substrate. The processing apparatus can perform the following steps: (A) moving the end effector and a digital sensor linearly from a first position across the stage to a second position; (B) detecting the digital measurement result of the digital sensor in step (A). (C) A reference point located on the outer side of the periphery of the mounting portion; (D) Based on the reference point, a first correction control is implemented to correct the position of the transport robot relative to the processing chamber; (E) The terminal effector and the digital sensor move linearly from the first position across the table to the corrected second position; (F) Based on the digital measurement result of the digital sensor in step (D), the inner periphery of the annular member is detected, and the periphery of the mounting portion is detected with the inner periphery as a reference; (G) Based on the detection result of the periphery of the mounting portion, a second correction control is implemented to correct the position of the transport robot relative to the processing chamber.
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