Semiconductor heat treatment equipment

Abstract

This application discloses a semiconductor heat treatment equipment, including an inner process tube, an outer process tube, a mounting base, an air inlet structure, and an exhaust structure. Both the first end and the second end of the inner process tube are configured as open structures. Space within the area defined by the inner process tube forms a reaction space. The first end of the outer process tube is configured as an open structure, and the second end of the outer process tube is configured as a close structure. The outer process tube is sleeved outside the inner process tube, and an annular air inlet cavity is formed between the inner process tube and the outer process tube. The mounting base is annular, with both the first end of the inner process tube and the first end of the outer process tube sealed to it. A gap exists between the second end of the inner process tube and the inner wall of the second end of the outer process tube. The air inlet structure communicates with the annular air inlet cavity through an air inlet.

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